Aimed at portable devices such as camera phones, the 6.1 x 6.3-mm OV3630 3.2-Mpixel CMOS image sensor module has a 2,048 x 1,536 array of 2.2-µm pixels and a 1/3.2-in. lens format. The device's 10-bit ...

TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO:6502) announced today that the launch of "CIPS183BS210", a Contact Image-Sensor Module with a faster data rate, for application in banknote ...

Phase One has just announced three new additions to their range of IQ backs: the Phase One IQ180, IQ160, and IQ140. These professional sensor modules are designed to fit on the back of medium format ...

Toshiba Corporation announced that the launch of CIPS183BS210, a Contact Image-Sensor Module with a faster data rate, for application in banknote recognition systems. Mass production is scheduled to ...

The ASIL-C sensor is claimed to be the smallest in the industry, while the module targets driver-monitoring hardware. Among the primary challenges facing engineers developing imaging sensors for ...

The high-sensitivity image sensor modules are versatile. Imaging applications include real- time non-destructive inspection techniques such as food screening, plastic sorting, semiconductor inspection ...

Lite-On Semiconductor, a Taiwan-based vendor of CMOS image-sensors and other discrete ICs, has begun volume shipments of its 1.3-megapixel CMOS image-sensor modules, made using a chip-on-board (COB) ...

The CMOS Image Sensor Module market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, ...

Fujitsu recently announced that it has developed and is making commercially available a CMOS color image sensor module, the MB86S02A micro-camera module, for mobile phone and PDA applications. The 110 ...

This image sensor module is equipped with an InGaAs linear image sensor. IT has sensitivity in the near infrared region of 0.95 to 1.7 μm, and is capable of readout at a high-speed line rate of 40 ...

Toshiba Corporation announced that the launch of CIPS183BS210, a Contact Image-Sensor Module with a faster data rate, for application in banknote recognition systems. Mass production is scheduled to ...